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DILB28P-223TLF
- 制造商 :
- Amphenol Communications Solutions
- 产品分类 :
- 集成电路插座
- Contact Finish - Mating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 100.0µin (2.54µm)
- Contact Finish Thickness - Post :
- 100.0µin (2.54µm)
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Open Frame
- Housing Material :
- Polyamide (PA), Nylon
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 28 (2 x 14)
- Operating Temperature :
- -55°C ~ 105°C
- Product Status :
- Active
- Termination :
- Solder
- 数据列表
- DILB28P-223TLF