ASP-184330-01

制造商 :

Samtec, Inc.

产品分类 :

阵列，边缘类型，夹层（板对板）

Connector Type :

High Density Array, Male

Contact Finish :

Gold

Contact Finish Thickness :

30.0µin (0.76µm)

Features :

Board Guide

Mated Stacking Heights :

8.5mm, 9.5mm, 10mm, 11mm, 11.5mm

Mounting Type :

Surface Mount

Number of Positions :

-

Number of Rows :

14

Product Status :

Active