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SMDSWLF.006 50G
- 制造商 :
- Chip Quik, Inc.
- 产品分类 :
- 焊接
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Flux Type :
- No-Clean, Water Soluble
- Form :
- Spool, 1.76 oz (50g)
- Melting Point :
- 423 ~ 428°F (217 ~ 220°C)
- Mesh Type :
- -
- Process :
- Lead Free
- Product Status :
- Active
- Shelf Life :
- -
- Shelf Life Start :
- -
- Storage/Refrigeration Temperature :
- -
- Type :
- Wire Solder
- Wire Gauge :
- 34 AWG, 38 SWG
- 数据列表
- SMDSWLF.006 50G